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The first batch of sample testing resources for STES cooperation is coming hot! SOLIDIGM P5430 TLC new product is officially unveiled.

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Back Home Product Center Memory Module or RAM (Random Access Memory) LRDIMM

M386AAG40AM3-CWE

M386AAG40AM3-CWE, Samsung DDR4, LRDIMM, 128GB, 4Rx43200Mbps, 1.2V, 288 (DDP8Gx4) x36

Key Features

Large capacity: M386AAG40AM3-CWE is a 128GB LRDIMM memory module, very suitable for server systems that require large capacity memory
High speed: This memory module has a speed of up to 3200Mbps and can quickly handle large databases, virtual machines, AI, and machine learning workloads
Advanced architecture: Adopting DDR4 technology, memory achieves progress in increasing throughput and improving energy efficiency
Low voltage: A low voltage design of 1.2V not only reduces power consumption, but also provides better geothermal management and long-term stability
Dedicated to large data centers: This memory module is mainly applicable to large data centers, cloud computing and High-performance computing, and is very useful for companies and institutions that need to process large amounts of data
High reliability: Supports ECC and verification, can automatically check and fix errors in memory, ensuring data integrity and reliability
Better heat dissipation performance: In order to better protect the stability of memory, M386AAG40AM3-CWE adopts a special PCB design, high-quality heat dissipation fins, and heat dissipation backplane, which can effectively reduce the temperature of the memory module and extend the service life of the memory.

Datasheet:

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M386AAG40AM3-CWE is a 128GB LRDIMM DDR4 memory module produced by Samsung, with an ultra high speed of 3200Mbps, equipped with a 4Rx4 architecture, and a standard 288 pin DDP8Gx4 x 36. This memory module is specially designed for various workloads in large data centers, cloud computing and High-performance computing.
It supports ECC and verification, and can automatically check and fix errors in memory, ensuring data integrity and reliability. In addition, the memory module adopts a low voltage design of 1.2V, which performs well in both power consumption and thermal management. In order to better protect the stability of memory, M386AAG40AM3-CWE adopts a special PCB design, high-quality heat dissipation fins, and heat dissipation backplane, which can effectively reduce the temperature of the memory module and extend the service life of the memory.

Parameter	Value
Model	M386AAG40AM3-CWE
Capacity	128GB
Architecture	4Rx4
Rate	3200Mbps
Voltage	1.2V
Pin Count	288
Memory Type	LRDIMM
Register	Registered
Organizational Type	X4
Organization Structure	DDP8Gx4 x 36
Cascading Scheme	2DPC
Special Functions	ECCParity
Other Characteristics	High heat dissipation
Applicable Fields	Large data centers, cloud computing, High-performance computing
Applicable System	Server systems with standard DDR4 interface